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-MOCVD wafer automatic loading and unloading

-GBT-P7A-700  (More)

-Two SCARA robots and one articulated robot are integrated with the preceding equipment to facilitate the loading and unloading process for both processed and unprocessed wafers.

-Cost reduction, increased capacity and efficiency 

-Ensured labor cost savings and production stability

-Robots certified for use in a dust-free environment, meeting national cleanliness requirements 

-Equipped with high-speed I/O for wafer mapping inspection 

-High stability ensures gentle wafer handling and tray placement without collisions

-Wafer positioning accuracy: ±0.05mm、±0.1° 

-Wafer loading and unloading Cycle Time: 425pcs/h 

-High Position Repeatability (Position repeatability: 0.02mm), ensuring damage

-free during wafer loading and unloading -Jitter-free in high-speed wafer handling for efficient loading and unloading 

-Yield Rate: ≥99.9%